Wire Bonding: Cost Performance & Flexibility13 Jan 2022As representatives of MPP (Micro Point Pro LTD) in the Eastern USA and Canada we are continually impressed with their…
MoldMaking Technology Interviews NDC President Kevin Hartsoe28 Dec 2021Christina Fuges, Editorial Director, at MoldMaking Technology interviewed Kevin Hartsoe of Neu Dynamics earlier this month. Kevin is President at…
Introducing: Sinterstar Mini from Boschman27 Nov 2021We are excited to announce the availability of the new Sinterstar Mini! Boschman Technologies unveiled this system earlier this month…
FA Systems Laser Enclosures Exceed Expectations25 Oct 2021NDC International has long offered systems from FA Systems Automation (FASA). Based in Singapore and established in 1988, FA Systems…
We’re Taking on the EV Market!31 Aug 2021Neu Dynamics and NDC International were recently featured in an article in MoldMaking Technology by Christina Fuges entitled, “Thermoset Mold…
Featuring: Teikoku Taping System (TTS)6 Aug 2021NDC International is proud to announce our relationship with Teikoku Taping System Co., Ltd (TTS). The company was founded in…
HANMI micro SAW Offers Superior Reliability & Productivity29 Jun 2021NDC International has represented HANMI’s full equipment line for decades! For over 40 Years HANMI Semiconductor has focused on building…
In Memory of Dave Campbell24 Jun 2021It is with deep sadness that the team at Neu Dynamics says goodbye to Dave Campbell, Senior Vice President and…
Boschman Package Development – Leaders in SiC Power Modules26 Apr 2021Boschman Package Development is a Dutch company that develops industry-defining packaging solutions for MEMs, sensors, power devices and medical/optical products.…
Best-In-Class Manual Wire Bonders from MPP26 Feb 2021MPP (Micro Point Pro LTD) has been a leading supplier of wire bonding machinery for over 40 years! MPP has…
K&S: New Generation Hub Blades for Silicon Wafer Dicing25 Jan 2021Kulicke & Soffa (K&S) serves the automotive, consumer, communications, computing and industrial markets as a top provider of semiconductor and…
Package Development for Power Modules19 Dec 2020We are proud to represent Boschman Package Development. Based in the Netherlands, Boschman has been a leading high-tech player in…