Blog

TFA Flex Line: Trim & Form System for Power Modules

27 Jul 2022

We are pleased to inform you that NDC is now representing Trim Form Automation (TFA) Europe! TFA Europe is focused…

30 Jun 2022

In May, HANMI Semiconductor was named one of the “Top 10 Semiconductor Equipment Companies” in the world by TechInsights. HANMI…

25 May 2022

Teikoku Taping Systems (TTS) was established in 1995 and has grown to build a strong reputation in the semiconductor manufacturing…

8 Apr 2022

Boschman featured their new Sinterstar Mini a few weeks ago at the Applied Power Electronics Conference 2022 (APEC) in Houston. …

1 Mar 2022

Neu Dynamics is proud to represent budatec GmbH – a leading machine manufacturer for the semiconductor and solar industry. Based…

13 Jan 2022

As representatives of MPP (Micro Point Pro LTD) in the Eastern USA and Canada we are continually impressed with their…

28 Dec 2021

Christina Fuges, Editorial Director, at MoldMaking Technology interviewed Kevin Hartsoe of Neu Dynamics earlier this month. Kevin is President at…

27 Nov 2021

We are excited to announce the availability of the new Sinterstar Mini! Boschman Technologies unveiled this system earlier this month…

25 Oct 2021

NDC International has long offered systems from FA Systems Automation (FASA). Based in Singapore and established in 1988, FA Systems…

31 Aug 2021

Neu Dynamics and NDC International were recently featured in an article in MoldMaking Technology by Christina Fuges entitled, “Thermoset Mold…

6 Aug 2021

NDC International is proud to announce our relationship with Teikoku Taping System Co., Ltd (TTS). The company was founded in…

29 Jun 2021

NDC International has represented HANMI’s full equipment line for decades! For over 40 Years HANMI Semiconductor has focused on building…