Neu Dynamics Corp. Appoints Nicholas Leonardi to Business Development Role
Philadelphia, PA, September 23, 2024 – Neu Dynamics Corp. (NDC) is pleased to announce the appointment of Nicholas Leonardi to…
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Meet Boschman at the Battery Show
Are you attending The Battery Show North America in October? If so, we invite you to stop by Booth #2550…
Meet Powertrim Technologies
Leading the Way in Trim & Form Systems for Power Modules In June of 2024, Trim Form Automation (TFA) Europe…
Powerful Vacuum Soldering Systems from Budatec
If you are in the market for a vacuum soldering system, don’t miss the opportunity to meet budatec at the…
ESTEK Group – Performance & Quality
NDC International is pleased to announce that we are partnering with ESTEK Group to distribute their CMOS Imaging Sensor Inspection…
New Test Handlers from FA Systems
We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability…
Sinterstar Mini – Fast, Flexible & Practical
Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice…
NDC – More than Meets the Eye!
As one of our current customers or contacts you may know us for molds and molding presses, but did you…
Leading Ag-Sintering Technologies from Boschman
Boschman has been leading the way in sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company,…
Maximize Your Productivity with the HANMI Wafer micro SAW
HANMI’s innovative micro SAW line was launched in 2021 and now offers 8 models! For our customers specializing in wafer…
HANMI’s TC Bonder Line Continues Expansion
HANMI is always at the leading edge of innovation. That’s why we were not surprised that they were among the…
HANMI’s Package Singulation Saw – The micro SAW P2101
HANMI’s Rapid Development of the micro SAW Line Founded in Korea in 1980, HANMI Semiconductor has grown to become a…