Neu Dynamics is a leading supplier of semiconductor encapsulation molds and overmold solutions including tooling for SOIC, TQFP, SSOP and LED packages, as well as conventional DIPs. We provide an array of molds and dies and are familiar with existing automatic multi-plunger and conventional molding systems.
Opto-Electronic Encapsulation / Fiber Optic Encapsulation
We provide encapsulation and mold tooling for the semiconductor, medical, automotive and electronics industries, including production and development tooling for both thermoset and thermoplastic materials. Our high-cavitation molds – which meet the growing demand for opto-electronic type devices – incorporate features to minimize mold base footprint to allow for maximum mold flow and increased cavitation resulting in optimum yields per cycle.