Announcing: HCL Hub Blades Series from K&S24 Sep 2019NDC International is the North American distributor for Kulicke & Soffa (K&S) brand dicing blades and capillaries. K&S – founded…
Now Available: MPP Wedge Bonding Tools!27 Aug 2019NDC International has been representing the Micro Point Pro LTD (MPP) line of manual wire bonders in the USA, Mexico…
Featuring: budatec Vacuum Soldering Systems14 Jun 2019NDC International representing budatec GmbH in North America. Budatec is based in Berlin, Germany and specializes in developing equipment for…
Best-In-Class Contract Molding Team25 Apr 2019Neu Dynamics Corporation’s (NDC) dedicated Contract Molding Team stands ready to assist clients with their toughest problems! Offering best-in-class technologies…
K&S Capillaries: Enhanced Bonding Quality29 Mar 2019NDC International is the North American distributor for the Kulicke & Soffa (K&S) dicing blades and capillaries. K&S Capillary Consumables…
Contract Molding Services27 Feb 2019Neu Dynamics Corporation (NDC) has been offering contract molding services for over 20 years. NDC provides a unique combination of…
Spotlight On: MPP’s iBond 5000 Series31 Jan 2019About Micro Point Pro Ltd. Founded in 2010, Micro Point Pro Ltd. (MPP) is a global leader in the semiconductor…
Boschman Expands Ag-Sinter Market Share17 Dec 2018Boschman Technologies – recently re-branded as Boschman Advanced Packaging Technologies – just announced a milestone in the ag-sinter market for…
Great Deals on the MPP iBond 5000!13 Nov 2018If you are in the market for an advanced ball/wedge bonder, then we’ve got good news for you! We are…
APC Develops SiC Power Module for Tesla Model 37 Nov 2018NDC International represents APC (Advanced Packing Center) in the Eastern United States. APC is a Dutch company founded by Boschman…
Now Representing budatec Vacuum Soldering Systems!18 Sep 2018NDC International is proud to announce that we are now representing budatec GmbH in North America. Budatec develops equipment for…
Join Us at EPS Sept 18th & 19th!21 Aug 2018The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC…