Blog

Contract Molding Services

27 Feb 2019

Neu Dynamics Corporation (NDC) has been offering contract molding services for over 20 years. NDC provides a unique combination of…

31 Jan 2019

About Micro Point Pro Ltd. Founded in 2010, Micro Point Pro Ltd. (MPP) is a global leader in the semiconductor…

17 Dec 2018

Boschman Technologies – recently re-branded as Boschman Advanced Packaging Technologies – just announced a milestone in the ag-sinter market for…

13 Nov 2018

If you are in the market for an advanced ball/wedge bonder, then we’ve got good news for you! We are…

7 Nov 2018

NDC International represents APC (Advanced Packing Center) in the Eastern United States. APC is a Dutch company founded by Boschman…

18 Sep 2018

NDC International is proud to announce that we are now representing budatec GmbH in North America. Budatec develops equipment for…

21 Aug 2018

The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC…

11 Jul 2018

Since the Fall of 2017 NDC International has been representing Haecker Automation in North American. Haecker is a family-owned company…

28 Jun 2018

Silver Sintering is an exciting new technology that has captured the interest of our customers this year. We are now…

24 May 2018

Stop by and see us at the Electronic Components and Technology Conference (ECTC) to be held May 29 through June…

16 Apr 2018

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts. The theme…

23 Mar 2018

NDC International is pleased to announce that we are now representing Master Machinery Corporation (MMC). As a leading manufacturer and…