NDC represents MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico. MAT provides proven, simple solutions for your complex die attach applications. They leverage their 35 years of experience to bring you die attach machines with unmatched versatility and lowest cost of ownership. MAT specializes in complex, high-value applications for microelectronics assembly.
Laser Focus on Die Attach
Because MAT’s focus is exclusively on die attach technology, they have been able to deliver unmatched flexibility, value and change over speed. Capability for all known die attach processes is already implemented into their base machine. Whether your application be eutectic or adhesive based, Flip Chip or Face Up, MCM, Die Stacking, MEMS, Imaging Device or other, MAT’s machines will handle it with high accuracy and yield. Plus you get ultimate versatility for the future with hardware add-ons that make expanding capabilities simple.
MAT Die Attach Machines
There are currently two MAT die attach systems. Both have the same software and basic capabilities which means you can transfer recipes between machines. The 6500 Model is a floor model that can handle wafers. The 6200 is a table-top model that handles die from carrier trays and waffle packs.
Both MAT systems offer 3 main advantages. First, there is no competition at this price point. Second, the machines are extremely easy to program and customers say that switching processes takes only minutes or seconds! And finally, the machines have an open design which makes them incredibly flexible.
MODEL 6500: Automatic, High Accuracy Die Attach System
The Model 6500 Automatic Die Attach System performs advanced and complex die attach processes with high accuracy, incredible versatility and a very large work area.
Specification Highlights:
- Mode of Operation: Fully automatic process with manual or automatic material load/unload.
- Processes: Cold and High Temperature -MCM, Flip Chip, Eutectic, Ultrasonic, Silver Glass, etc.
- Die Size Range: 0.150 to over 50 mm.
- Die Materials: Silicon, GaAs, Glass, Metal, Ceramic, Other.
- Die Presentation: Up to 300 mm Wafers, 2”/4” Waffle/Gel Packs, Reel Feeders.
- Substrates: BGA, Lead Frames, Ceramic, Silicon Wafers, Glass, Metal, PCB, TO, Other.
- Work Area: Up to 20” x 12” (configuration dependent).
- Placement Accuracy: ±3 µm (application dependent).
- Throughput: Up to 1000 CPH (application dependent).
- Footprint: 1.25 sq. meters.
Click here for the full brochure.
MODEL 6200: Automatic Die Attach System, The Crossover
The Model 6200 Automatic Table-Top Die Attach System offers best price/performance in a “crossover” system that has unmatched versatility and very high placement accuracy. It performs the widest range of cold and heated die attach processes on the same machine.
Specification Highlights:
- Mode of Operation: Fully automatic process from waffle/gel packs and/or reel feeders with manual material load/unload.
- Processes: Cold and High Temperature -MCM, Flip Chip, Eutectic, Ultrasonic, Silver Glass, Ag Sintering etc.
- Die Size Range: 0.150 to over 50 mm.
- Die Materials: Silicon, GaAs, Glass, Metal, Ceramic, Other.
- Die Presentation: Up to Ten 2” Waffle/Gel Packs, Up to Three 4” Waffle/Gel Packs, Up to 8 Reel Feeders.
- Substrates: BGA, Lead Frames, Ceramic, Silicon Wafers, Glass, Metal, PCB, TO, Other.
- Work Area: 7” x 6” (configuration dependent).
- Placement Accuracy: Better than ±3 µm (application dependent).
- Throughput: Up to 700 CPH (application dependent).
- Configuration: Table-top.
Click here for the full brochure.
Check Out the MAT Die Attach Systems in Action
This video shows the MAT machines in action and includes the following die attach applications:
- Dispense Pick & Place
- P&P on Ceramic Substrate
- P&P VCSEL and PD
- Dispense P&P on Lead Frame with BLT Control
- Dispense P&P of Large Die with BLT Control
- Die Attach Film Process
- Eutectic Gold Silicon
- Thermo-Sonic Gold Bump Flip Chip
These die attach systems offer incredible flexibility, accuracy and value.
