ESTEK Group – Performance & Quality28 Jun 2024NDC International is pleased to announce that we are partnering with ESTEK Group to distribute their CMOS Imaging Sensor Inspection…
New Test Handlers from FA Systems22 May 2024We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability…
Sinterstar Mini – Fast, Flexible & Practical10 May 2024Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice…
NDC – More than Meets the Eye!29 Mar 2024As one of our current customers or contacts you may know us for molds and molding presses, but did you…
Leading Ag-Sintering Technologies from Boschman14 Feb 2024Boschman has been leading the way in sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company,…
Maximize Your Productivity with the HANMI Wafer micro SAW30 Jan 2024HANMI’s innovative micro SAW line was launched in 2021 and now offers 8 models! For our customers specializing in wafer…
HANMI’s TC Bonder Line Continues Expansion29 Dec 2023HANMI is always at the leading edge of innovation. That’s why we were not surprised that they were among the…
HANMI’s Package Singulation Saw – The micro SAW P210129 Nov 2023HANMI’s Rapid Development of the micro SAW Line Founded in Korea in 1980, HANMI Semiconductor has grown to become a…
Superior Test Handlers from FA Systems30 Oct 2023FA Systems Test Handlers Deliver Reliability & Performance NDC International is proud to represent FA Systems Automation (FASA). For 35…
MAT 6200 Die Attach System– Simple is Better27 Sep 2023See the MAT 6200 Die Attach System at iMAPS – Booth #402! MAT has 35 years of experience… and it…
Budatec’s Innovative Vacuum Soldering Systems25 Aug 2023Budatec GmbH has over 30 years of experience in vacuum soldering technology. Based in Berlin, they offer vacuum soldering and…
Great Deals on MPP Wire Bonders!30 Jul 2023Are you in the market for a wire bonder? Looking to replace a used or outdated wire bonding machine? MPP…