HANMI is always at the leading edge of innovation. That’s why we were not surprised that they were among the first companies to develop a TC bonder (thermal compression bonder). These machines, which bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5.
DUAL TC BONDER 1.0 DRAGON
In early August, HANMI announced that they opened a new bonder factory to expand production capacity of their new DUAL TC Bonder. Then on August 24th they released the DUAL TC BONDER 1.0 DRAGON, a second-generation model of essential HBM process equipment for artificial intelligence (AI) semiconductors.
DUAL TC BONDER GRIFFIN
In the months that followed they continued to expand the TC bonder line. On September 19th HANMI announced that the third-generation DUAL TC BONDER GRIFFIN was released. Vice Chairman, DS Kwak, said that this bonder offers “significant improvement in productivity and precision for stacking semiconductor chips for next-generation HBM production.”
This model and the previous one (1.0 Dragon) have won the attention of SK Hynix – the world’s 2nd largest memory chipmaker and 3rd largest semiconductor company. They placed significant orders for both models (KRW 60 billion and 40 billion respectively).
TC BONDER 2.0 CW
HANMI introduced their TC BONDER 2.0 CW at SEMICON Taiwan in September. A spokesperson for the company said that this “2.5D packaging bonder… attaches artificial intelligence GPUs and HBM semiconductors to silicon interposers. It is applicable to CoWoS packaging, the next-generation technology of TSMC, which has recently been the center of attention as an artificial intelligence semiconductor.”
TC BONDER 2.0 CS
The final machine in their line is the TC BONDER 2.0 CS. This “Chip to Substrate” machine is designed for thermal compression bonding for memory devices.
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