Teikoku Taping Systems (TTS) was established in 1995 and has grown to build a strong reputation in the semiconductor manufacturing industry. In April of 2021 they became a subsidiary of Nippon Kayaku expanding their ability to provide total solutions to customers. Their operational base includes their head office in Japan and two regional headquarters in the US and Singapore. TTS offers semiconductor manufacturing equipment in 4 categories including laminators for taping, removers for de-taping, mounters for mounting wafers onto frames and UV irradiators.
Tradition of Leadership & Innovation
TTS strives to create a total solution focusing on equipment and materials in the alliance approach, remaining flexible and collaborative. They are leaders in the semiconductor manufacturing arena with a focus on developing proprietary technologies that maximize manufacturing production. They have several important patents on file for their innovative technologies including their bumper table which is digitally controlled and offers superior dry film resist tenting applications due to the ability to adjust lamination height.
Recently named a “Top 10 Semiconductor Manufacturing Solutions Provider in APAC 2022” by Semiconductor Review, TTS’ laminators are the industry standard.
TTS Laminator Line
TTS offers 4 fully-automatic laminators and vacuum laminators. In addition, a semi-automatic model is also available.
VXL-1200X 300mm Fully-Automatic Vacuum Laminator
- A vacuum laminator for wafers of 300mm (optionally available: 8 inches)
- Single and double cassette loading
- Two cutting methods (including V-notch cutting):
- Digital cutter blade method
- Pre-Cur method
- All parameters important for taping can be controlled in the recipe
- Equipment can be configured with ultimate vacuum at 100Pa
- Can be used with thinner wafers such as shaped or reworked wafers
- Other optional features are available
EXL2-1200X 300mm Fully-Automatic Wafer Tape Laminator
- A tape laminator for wafers up to 300mm (optionally available: 8 inches)
- Single and double cassette loading
- Two cutting methods (V-notch cutting):
- Digital cutter blade method
- Class 4 CO2 laser method
- All parameters important for taping can be controlled in the recipe
- Can be used with thinner wafers such as shaped or reworked wafers
- Other optional features are available
DXL2-800X 200mm Fully-Automatic Wafer Tape Laminator
- A tape laminator for wafers up to 200mm (8inches) (4-,5-,6-, and 8-inch)
- Two cutting methods (V-notch cutting):
- Digital cutter blade method
- Class 4 CO2 laser method
- All parameters important for taping can be controlled in the recipe
- Can be used with thinner wafers such as shaped or reworked wafers
- Other optional features are available
CPL-300CS Fully Automatic Panel Laminator
- Standalone multifunction panel laminator for custom solutions
- Fully automatic laminator for a range of panel sizes (please contact us to discuss)
- Cutting by TTS digital cutter blade will follow exact panel size
- Applicable for TTS inline pre-cut tape lamination
- Other optional features are available including tape removal function, inline LED UV irradiation, vacuum lamination etc.
The TTS Difference
TTS has supplied innovative systems to the semiconductor manufacturing industry for over 25 years. Their cutting edge technologies and proven systems have made them a leading equipment supplier for dry film resist applications and specifically lamination.
