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APC Develops SiC Power Module for Tesla Model 3

NDC International represents APC (Advanced Packing Center) in the Eastern United States. APC is a Dutch company founded by Boschman Technologies in 2010. APC focuses on highly innovative packaging solutions for MEMs, Sensors, Powers and IC’s. They provide a wide range of packaging services and support from concept-design to transfer to mass production. Tesla’s adoption of APC’s SiC MOSFETs in the Tesla Model 3 is one of biggest pieces of …Read More

Now Representing budatec Vacuum Soldering Systems!

NDC International is proud to announce that we are now representing budatec GmbH in North America. Budatec develops equipment for the semiconductor and photovoltaics industries. Based in Berlin, Germany, budatec has more than 20 years of experience in developing vacuum soldering technologies ranging from small R&D furnaces to fully automated soldering systems. They are a technological leader in this segment specializing in the use of hydrogen and plasma gases. Vacuum …Read More

Join Us at EPS Sept 18th & 19th!

The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC International will be displaying in the exhibit hall both days. Stop by to meet us and learn about our packaging equipment – including the innovative systems from Boschman Technologies! Electronics Packaging Symposium (EPS) 2018 – Programs The IEEE Electronics Packaging Society offers this symposium as part of its mission to …Read More

Haecker Automation’s OurPlant Pocket

Since the Fall of 2017 NDC International has been representing Haecker Automation in North American.  Haecker is a family-owned company from Germany that has provided future-oriented solutions in microsystems technology for over 20 years. They operate worldwide in the fields of micro assembly, micro and nano dispensing as well as in micro laser soldering. The Innovative OurPlant Assembly Platform The OurPlant Assembly platform is an innovative system with a modular …Read More

Discover Silver Sintering at SEMICON West!

Silver Sintering is an exciting new technology that has captured the interest of our customers this year.  We are now representing Boschman Technologies – a company with a reputation for innovation which specializes in the development and supply of advanced Film-Assisted Molding (FAM) and Sintering Systems for electronic assembly industries across the globe. Boschman has been a high-end niche player within the semiconductor packaging equipment industry since 1987. Going to …Read More

See You at ECTC 2018!

Stop by and see us at the Electronic Components and Technology Conference (ECTC) to be held May 29 through June 1, 2018 in San Diego!  We will be in Booth #603 in the sold-out exhibit space along with 106 other exhibitors representing a wide field of technologies.  It should be a great program with 40 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, …Read More

Neu Dynamics at iMaps New England – Booth #104

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts.  The theme is “Into the Future Autonomously” and the Symposium will feature a keynote by Chris Jacobs the Vice President of Autonomous Transportation & Safety at Analog Devices, Incorporated.  Come join us and learn more about the challenges and innovations of autonomous transport. More info here:  http://www.imapsne.org Stop By Booth 104 to …Read More

NDCI Now Representing Master Machinery Corp.

NDC International is pleased to announce that we are now representing Master Machinery Corporation (MMC).  As a leading manufacturer and supplier of diodes, rectifiers and semiconductor process equipment and components, MMC offers affordable custom automation. Based in Taiwan, for over 20 years MMC has been a leading supplier of test-mark-tape (TMT) handlers, marking & tape/reel machines, automated assembly equipment & tooling.  The roots of the company go back to 1978 …Read More

NTAP Helps You Invest in Your Workforce

Apprenticeships Are Good for Businesses … and Workers Here at Neu Dynamics we believe in investing in our workforce in the form of apprenticeships.  They are a WIN/WIN for everyone and help ensure we have the skilled workforce and dedicated employees we need to grow our business.  The NTMA (National Tooling and Machining Association) Tri-State Apprenticeship program (NTAP) is a regional competency-based apprenticeship training program. Rather than the traditional 4-year …Read More

Silver Sintering for Electronic & Semiconductor Applications

Reliability of Ag-Sintering Bonding Technology Through a relationship announced a few months ago, NDC International is now representing Boschman Technologies in the Eastern USA.  Boschman, based in the Netherlands, has been a high-end niche player in the semiconductor packaging equipment industry since 1987.  They specialize in the development of advanced Film-Assisted Molding (FAM) and silver sintering systems for electronic assembly industries across the globe. Boschman has been one of the …Read More