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K&S Capillaries: Enhanced Bonding Quality

NDC International is the North American distributor for the Kulicke & Soffa (K&S) dicing blades and capillaries. K&S Capillary Consumables has over 40 years of experience and is a leader in the semiconductors assembly industry – developing and manufacturing advanced bonding tools for a wide array of applications. Their latest capillary products offer enhanced bonding quality and best cost-of-ownership. Quantis™ QFN: Cutting Edge Solutions for Copper Wire Bonding Based on …Read More

Contract Molding Services

Neu Dynamics Corporation (NDC) has been offering contract molding services for over 20 years. NDC provides a unique combination of technology and experience in the design and production of precision molds and dies for the medical, semiconductor, automotive, electronics and plastics industries. We offer a range of tool sizes from prototype hand molds to multi-cavity production molds, providing turnkey services to design manufacturing molds to your exact needs. Our goal …Read More

Spotlight On: MPP’s iBond 5000 Series

About Micro Point Pro Ltd. Founded in 2010, Micro Point Pro Ltd. (MPP) is a global leader in the semiconductor industry offering comprehensive solutions for high-precision tools for the micro-electronics and packaging industries. MPP acquired Kulicke and Soffa’s wire bonder business three years ago. Today MPP offers a range of machines from the well-known 4500 Series to the advanced iBond 5000 Series. Their Ball, Wedge and Dual Wire Bonders offer …Read More

Boschman Expands Ag-Sinter Market Share

Boschman Technologies – recently re-branded as Boschman Advanced Packaging Technologies – just announced a milestone in the ag-sinter market for electrical vehicles. NDC International represents Boschman, an innovative company founded in 1987 and located in the Netherlands. Boschman is a high-end niche player within the semiconductor packaging equipment sector providing full production solutions specifically in transfer-molding and silver sintering die-attach, including package development and assembly services. Boschman’s Proprietary Technologies Lead …Read More

Great Deals on the MPP iBond 5000!

If you are in the market for an advanced ball/wedge bonder, then we’ve got good news for you! We are offering great deals on the Micro Point Pro LTD (MPP) iBond 5000. NDC International represents the MPP line of manual wire bonders in the USA, Mexico and Canada. The long-time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP. The iBond 5000 Series …Read More

APC Develops SiC Power Module for Tesla Model 3

NDC International represents APC (Advanced Packing Center) in the Eastern United States. APC is a Dutch company founded by Boschman Technologies in 2010. APC focuses on highly innovative packaging solutions for MEMs, Sensors, Powers and IC’s. They provide a wide range of packaging services and support from concept-design to transfer to mass production. Tesla’s adoption of APC’s SiC MOSFETs in the Tesla Model 3 is one of biggest pieces of …Read More

Now Representing budatec Vacuum Soldering Systems!

NDC International is proud to announce that we are now representing budatec GmbH in North America. Budatec develops equipment for the semiconductor and photovoltaics industries. Based in Berlin, Germany, budatec has more than 20 years of experience in developing vacuum soldering technologies ranging from small R&D furnaces to fully automated soldering systems. They are a technological leader in this segment specializing in the use of hydrogen and plasma gases. Vacuum …Read More

Join Us at EPS Sept 18th & 19th!

The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC International will be displaying in the exhibit hall both days. Stop by to meet us and learn about our packaging equipment – including the innovative systems from Boschman Technologies! Electronics Packaging Symposium (EPS) 2018 – Programs The IEEE Electronics Packaging Society offers this symposium as part of its mission to …Read More

Haecker Automation’s OurPlant Pocket

Since the Fall of 2017 NDC International has been representing Haecker Automation in North American.  Haecker is a family-owned company from Germany that has provided future-oriented solutions in microsystems technology for over 20 years. They operate worldwide in the fields of micro assembly, micro and nano dispensing as well as in micro laser soldering. The Innovative OurPlant Assembly Platform The OurPlant Assembly platform is an innovative system with a modular …Read More

Discover Silver Sintering at SEMICON West!

Silver Sintering is an exciting new technology that has captured the interest of our customers this year.  We are now representing Boschman Technologies – a company with a reputation for innovation which specializes in the development and supply of advanced Film-Assisted Molding (FAM) and Sintering Systems for electronic assembly industries across the globe. Boschman has been a high-end niche player within the semiconductor packaging equipment industry since 1987. Going to …Read More