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Visit NDC at ECTC: Booth #216

We’re gearing up for the ECTC!  The Electronic Components and Technology Conference (ECTC) will be held in Lake Buena Vista, Florida from May 30 through June 2, 2017.  This show brings together the best in international packaging, components and microelectronic systems science, technology and education.  The show is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This year, the ECTC will include 36 presentations of …Read More

Continuous Improvement at NDC Starts Top Down

At Neu Dynamics Corporation, a passion for client satisfaction and service excellence is at the core of our beliefs. Our continuous improvement initiative is not only internal and employee related, but also seeks input externally and starts from the top down.  That’s why Neu Dynamics CEO, Kevin Hartsoe, participates in bi-monthly CEO Network Groups with industry colleagues. The group is mentored and organized by Delaware Valley Industrial Resource Center (DVIRC) …Read More

News from Micro Point Pro (MPP)

Semiconductor Packaging News recently ran a feature on Micro Point Pro Ltd. Neu Dynamics Corporation is pleased to represent MPP and we are excited to share the thoughts of their CEO, Oren Saar, recapping 2016 highlights and plans for 2017. 2016 Recap: 2016 was a year of unexpected growth and new challenges for MPP. Notably, in 2016 MPP expanded their portfolio by acquiring Kulicke and Soffa’s Manual Wire Bonder Division. …Read More

NDC Awarded “Excellent” Supplier Rating from Microsemi

At Neu Dynamics Corporation, it is our goal to meet our clients’ needs with the highest-quality parts and materials, according to their schedule and at the lowest possible cost.  That’s why we are pleased to announce that Neu Dynamics Corporation recently received the highest possible “Excellent” Supplier Rating from Microsemi Lawrence. Microsemi is a provider of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets.  …Read More

NDC at iMAPS Device Packaging Show: Stop by Booth #59

The International Microelectronics Assembly and Packaging Society (iMAPS) will hold its 13th International Conference and Exhibition on Device Packaging in Arizona from March 7-9th, 2017. This conference will focus on the technologies and current challenges for packaging and devices of all types. The conference has 3 tracks: 1) 3D IC & Packaging, 2) Flip Chip & Wafer Level Packaging & FAN-OUT, 3) Engineered Micro Systems/Devices (includes MEMS & Sensors).  This …Read More

NDCI Now Directly Representing MPP Manual Wire Bonders

NDC International is happy to announce that they will now be directly handling sales and service for Micro Point Pro (MPP) Manual Wire Bonders in the Northeastern USA and Eastern Canada territories.  The long-time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP.  The newest MPP line is the iBond5000 Series and is based on the 4500 Series which was a market leader …Read More

Local Students Tour Our Facility

NDC / NDCI is proud to hire graduates of the Bucks County Community College Metal Training Program which is a course that prepares students for working in the machining, metal forming, fabrication, EDMing and related trades. On Friday, September 9th NDC / NDCI conducted a tour of our manufacturing facility designed to provide these local community college students direct exposure to the systems and equipment used in precision metal working …Read More

Two New Products Hit Big at IMAPS 2016

NDC International and Neu Dynamics Corporation recently attended the 49th Annual International Symposium on Microelectronics in Pasadena, California on October 11th and 12th.  The show was very successful and welcomed 125 exhibitors and 957 attendees – including more than 150 international attendees from 26 countries. NDC International presented two new products this year that were a big hit at the show. Howard Lasto from Air-Vac was on hand to demonstrate …Read More

IMAPS 2016: Stop by Booth #302

The 49th Annual International Symposium on Microelectronics will be held at the Pasadena Convention Center in Pasadena, California from October 10th to 13th, 2016.  Stop by our booth and say hello. We’ll be featuring our new Air-Vac pick and place assembly machine – the ONYX29DB Semiconductor Assembly System.  This breakthrough new ultra-precise, semi-automated die assembly and bonding system is a table-top unit that can be used for assembling almost anything.  …Read More

NDCI Adds ATI, Air Vac & MMC to Product Portfolio

It is with great pleasure NDC International announces 3 new additions to our product portfolio. The new products allow NDC International to continue to expand and service our customer base with continued support.   ATI Founded in 1996 ATI has specialized in Automated Metrology, Inspection System (AOI) and Bio Lab automation for various markets. such as semiconductors, LED, PCB and Photo-Voltaic Solar and Bio medical markets. NDCI will be representing …Read More