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Neu Dynamics at iMaps New England – Booth #104

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts.  The theme is “Into the Future Autonomously” and the Symposium will feature a keynote by Chris Jacobs the Vice President of Autonomous Transportation & Safety at Analog Devices, Incorporated.  Come join us and learn more about the challenges and innovations of autonomous transport. More info here:  http://www.imapsne.org Stop By Booth 104 to …Read More

Silver Sintering for Electronic & Semiconductor Applications

Reliability of Ag-Sintering Bonding Technology Through a relationship announced a few months ago, NDC International is now representing Boschman Technologies in the Eastern USA.  Boschman, based in the Netherlands, has been a high-end niche player in the semiconductor packaging equipment industry since 1987.  They specialize in the development of advanced Film-Assisted Molding (FAM) and silver sintering systems for electronic assembly industries across the globe. Boschman has been one of the …Read More

NDC Now Representing Boschman Technologies

NDC International Representing Boschman Technologies in the Eastern USA We are very proud to announce our new relationship with Boschman Technologies.  NDC International will now be representing Boschman in the Eastern USA.  We are especially excited about Boschman’s reputation for innovation and the resulting advanced systems they offer.  Boschman specializes in the development of advanced Film-Assisted Molding (FAM) and sintering systems for electronic assembly industries across the globe. Boschman Film-Assisted …Read More