We are looking forward to connecting with you at iMAPS next week from October 3rd through 6th. Stop by to see us in Booth #300 to take advantage of our MPP bonder show special discount and learn more about HANMI’s just released Wafer micro SAW.
HANMI Semiconductor – At the Leading Edge
HANMI made two major announcements earlier this month that continue to solidify their position as an industry leader.
First, they announced on the 14th that they have developed a fully automated Wafer micro SAW (micro SAW W1121) for sawing semiconductor wafers. They launched this cutting-edge addition to their line up at the ‘2022 Semicon Taiwan’ exhibition. It is an independent 12-inch wafer SAW that saws wafers attached on tape to wafer film frames.
This innovative equipment dramatically increases productivity, precision and user convenience when compared with the other options on the market. HANMI leveraged it’s more than 42 years of know-how including integrated precision processing, vision and setting technology.
Plus in a huge demonstration of confidence, HANMI is providing a 2-year warranty on every micro SAW! This Wafer micro SAW is their 6th release since last June and part of a stellar equipment line that includes:
- Dual-Chuck micro SAW (micro SAW P2101)
- 20-inch micro SAW for JUMBO PCB (micro SAW P1201)
- 12-inch micro SAW (micro SAW P1121)
- Tape micro SAW (micro SAW T2101)
- Glass micro SAW (micro SAW GL)
- Wafer micro SAW (micro SAW W1121)
HANMI Announces micro SAW R&D Center
The second announcement from HANMI Semiconductor came last week when they announced a new micro SAW R&D Center at their headquarters in Incheon, South Korea.
Construction on this cutting-edge facility began last June and has been recently completed. The facility includes 9 laboratories where research will be conducted to test innovations based on customer demand and is intended to cement HANMI’s position as a global leader in the micro SAW market.
PLUS, Don’t Miss Your Deal on the MPP Wire Bonder
At the show we are offering great deals on the MPP iBond5000 Series Wire Bonders!
The series consists of three basic units: Wedge, Ball and Dual. Each provides excellent repeatability and high yield. They are a great choice for a wide range of applications from process development to production, to research, or for added manufacturing support. MPP is an industry leader providing reliable, innovative and flexible solutions backed by their superior support and service.
Contact Kevin Hartsoe at 215-355-2460 for more details!
Give Kevin a call or stop by Booth #300 at iMAPS next week.