IVYLAND, Pennsylvania–Oct. 31, 2022—NDC International, Inc., a leading supplier of tooling for the semiconductor, automotive, medical and electronics industries, today announced its commitment to represent MicroAssembly Technologies, Ltd. (MAT) in the USA, Canada and Mexico.
Effective October 2022, MAT has signed a distributor agreement appointing NDC International the North American distributor of their die attach systems. For nearly 20 years NDC International has represented the world’s top suppliers of manufacturing equipment for semiconductor packaging, handling and assembly. Their world-class sales and support, and deep customer base will support MAT in leveraging its presence in the North American market.
“NDC International is pleased to announce that we are adding more capabilities to our customer base. We are now the North American distributor for MicroAssembly Technologies, Ltd. die attach systems. These systems complement our existing equipment lines perfectly. The customer base here in North America is high-mix low-volume and this system is a great fit for that market,” said Kevin Hartsoe, President of NDC International.
MAT specializes in innovating and manufacturing die attach machines for microelectronics assembly. Die attach is the first, and most important, process in assembling high quality microelectronic components and systems. The die attach machines manufactured by MAT precisely place and connect (bond) semiconductor components such as ASIC’s, microprocessors, sensors, MMIC’s, MEMS, VCSEL’s, photo diodes etc. into their packages using adhesive or metallurgical processes (eutectic, thermo-compression, ultrasonic, Ag sintering). Customers have the versatility to do many different processes for low- to mid- volume production with strong accuracy while addressing several different types of processes including multi-chip modules, imaging devices, sensors, MEMS, die stacking, flip chip and eutectic processes.
MAT is currently offering two main systems. Their latest model, introduced this year, is the high accuracy Model 6500 Automatic Die Attach System. This system performs advanced and complex die attach processes with high accuracy and a very large work area. The Model 6200 Automatic Table-Top Die Attach System offers best price/performance in a “crossover” system that has unmatched versatility and very high placement accuracy.
About NDC International, Inc.
NDC International offers a complete line of specialized assembly equipment built for today’s high-tech semiconductor assembly processes. NDC International distributes manufacturing equipment in North America for semiconductor packaging, handling and assembly. Founded in 2003 to provide turnkey solutions for backend encapsulation, NDC International has grown over the last 19 years to become one of the leading suppliers of tooling for the semiconductor, automotive, medical and electronics industries. They represent leading companies from around the globe including HANMI Semiconductor, Boschman, budatec, Kulicke & Soffa (K&S) and Micro Point Pro Ltd (MPP).
NDC International’s sister company Neu Dynamics Corporation (NDC) is an ISO 9001:2015 certified tool, mold and die manufacturer. Both companies have their headquarters in Ivyland, PA, USA. For more information visit ndc-int.com and neudynamics.com.
About MicroAssembly Technologies, Ltd.
MicroAssembly Technologies, Ltd. specializes in providing proven solutions to the die attach industry. Founded in January 2000, MAT is a dynamic team of engineers and applications specialists with many years of experience in the field of equipment for die attach. Their specific strengths are with complex, high value applications. The company is headquartered in Israel. Learn more at mat-ltd.com.