Yole Développement forecasts significant growth in the bioMEMS market in 2020. This sector which was worth $3.7 billion in 2019 is forecasted to grow 12.4% in 2020 to $4.2 billion. Over the long term, Yole projects a 9.2% compound annual growth rate which has the sector reaching $6.3 billion by 2025.
BioMEMS are microelectromechanical systems (MEMS) used in biological applications. They are MEMS sensors and microfluidic devices that are integrated into medical equipment utilizing micro-sensors, transducers, actuators, and electronic components. BioMEMS are used in in vitro diagnostic (IVD) and other life science applications.
Though the 2025 forecast is impressive, it is significantly lower than the forecast given previously. Specific sectors of the bioMEMS market have been negatively affected and others positively affected by Covid-19. During the pandemic, the spike in demand for respiratory systems will spur growth in bioMEMS while, long term, it is expected that demand for remotely connected medical devices will grow dramatically.
Microfluidic Chips Comprise Largest Market Segment
Microfluidic chips which are often polymer based make up an overwhelming 85% of the market, with the pressure sensors segment following way behind – in second position – at 5%.
Microfluidic chips are mainly used for pharmaceutical research and IVD testing. There are 3 main drivers Yole has identified for the use of MEMS and microfluidic technologies:
1) The telecommunications and IT environment, specifically 5G networks
2) Cost pressures on healthcare systems driving home care, point of care and wearable medical devices for monitoring of patients at home
3) Innovative technologies that have reduced power and miniaturized systems
Film Assisted Molding Technologies for BioMEMS
NeuDynamics is proud to represent Boschman Advanced Packaging Technologies. Their Film Assisted Molding (FAM) technology is a perfect solution for BioMEMS. FAM is a variation on the transfer molding process that results in improved package quality. When used in combination with Boschman’s proprietary Dynamic Insert Control Technology, it allows creation of packages with exposed areas down to 300 micron (versus 500 micron with conventional techniques) in a stable and robust process – offering many interesting application in MEMS, Sensors, medical, optical and power devices.