We’re gearing up for the ECTC!  The Electronic Components and Technology Conference (ECTC) will be held in Lake Buena Vista, Florida from May 30 through June 2, 2017.  This show brings together the best in international packaging, components and microelectronic systems science, technology and education.  The show is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.

This year, the ECTC will include 36 presentations of technical papers on a wide range of topics and 16 Professional Development Courses.  The Technology Corner Exhibits provide an opportunity to meet with and learn from industry leaders about current technological advances.

Visit Us at ECTC:  Booth #216

NDC will be exhibiting at ECTC from May 31 through June 1, 2017.

We will be displaying the MPP Wire Bonder: Model iBond 5000 Dual.  This Manual Wire Bonder can either be configured as a ball bonder or a wedge bonder offering convertibility between these 2 different processes.  In addition, we will feature the PINK Plasma System V6-G.  This unit is designed as a tabletop device for industrial small series production as well as for low-pressure plasma treatment in R&D laboratories. It operates in the microwave range and can be used for surface treatment processes, cleaning and activation.

We look forward to seeing you in the exhibit hall!

Looking to Register for the ECTC?

Event homepage: click here

Click here for complimentary Exhibit Hall passes!

To set up an appointment to meet with us at the show, click here to contact us.