Are you attending The Battery Show North America in October? If so, we invite you to stop by Booth #2550 where Neu Dynamics will be exhibiting along with Boschman Technologies.

Boschman specializes in advanced transfer molding and silver sintering systems. Recently we announced the launch of their Sinterstar Mini – the latest addition to their powerful line of sintering systems. The company has been on the leading edge of these technologies since they introduced the groundbreaking Sinterstar Innovate-F-XL in 2014. Boschman offers deep knowledge and experience, having supported many customers with sintering solutions over the past decade.

Advantages of Silver Sintering

Boschman’s latest sintering technologies address today’s need for void-free, strong bonding with high thermal and electrical conductivity – a demand of today’s smaller and higher power electronic devices. Sinter bonding results in a more reliable bond which improves both the performance and longevity of devices when compared to traditional solder methods. Plus, their unique patented silicon-free dynamic insert technology (DIT) guarantees equal pressure for multi-die applications.

Advantages include:

• Closed-loop, precise pressure control and monitoring.
• Pressure applied only on areas where required.
• Extremely long tooling life resulting in very low running costs.
• Enabling highest density tools with interspaces down to 400µm.
• Largest available effective sinter area of 350x270mm, providing a high UPH.
• Supporting a large variation of geometries, including clips.

Boschman’s Silver Sintering Systems

No matter your application, Boschman has a system that will meet your needs from small batch to large-scale production.

Low-Volume Production, R&D & Prototyping

NEW Sinterstar Mini:

• Designed for universities, laboratories, R&D departments and SME companies. This is an affordable entry system designed for small sintering trials.
• It is very easy to use – ready for operation in 45 minutes! It offers fast change-over, tons of flexibility and is a practical solution when you need to sinter a wide variety of products including die-to-substrate, die-to-leadframe, clips, preforms and package-to-heatsink attach applications.
• The system offers closed-loop pressure control meaning the insert pressure follows the programmed pressure. Plus, its Universal Base Tool contains one dynamic insert and requires minimal maintenance.
• Effective sinter area: 66x66mm

Sinterstar Innovate Series:

• The most universal semi-automatic sintering system for green, lead-free die attach technologies. This system can sinter a wide range of devices including LED, power, IGBT, QFN, clip/heatsinks, thyristor and custom designed power module devices.
• Offers the largest sinter area of 350x270mm and a precise temperature control up to 320 C.
• High-precision dynamic insert pressure control technologies allow sintering of multiple dies with different die thicknesses. Resulting in a controlled and predictable bond strength.

Models:

• Sinterstar Innovate F-XL:
  • Universal semi-automatic sintering system.
  • Ideal for R&D and low-volume manufacturing with high yield and high reliability.
  • Check out the system video here.

Medium-Volume & High-Volume Production

Sinterstar Inline and Sinterstar Auto:

• These fully-automatic Ag-sintering systems offer the absolute highest throughput available on the market. They can sinter a wide range of different devices including LEDs, power devices, clip/heatsinks assemblies, solar (CVP) cells, custom designed power modules and more.
• Offers the largest sinter area of 350×270mm.
• Precise process control and monitoring – logging a large number of key parameters to auto control the quality with pre-set upper and lower control levels.
• Can be equipped with a large variety of sintering tool concepts.

Models:

• Sinterstar Inline-F-XL-HC:
  • Fully automatic and can be integrated in your automated assembly line.
  • Equipped with preheating and cooling stations.
• Sinterstar Auto-F-XL-HC:
  • Fully-automated and stand-alone system works from cassette input to cassette output.
  • Equipped with preheating and cooling stations.

Increase Your Reliability & Yield

We hope you will visit our Booth #2550 at The Battery Show North America from October 8^th – 10^th in Detroit. Our partners at Boschman are eager to meet you and to answer your questions about their powerful systems. We look forward to discussing how their systems can increase your reliability and yield.

Not attending The Battery Show? Call Kevin Hartsoe or Don Johnson today at 215-355-2460!