Boschman has been leading the way in sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company, based in the Netherlands, specializes in advanced transfer molding and sintering systems. NDC International represents Boschman Advanced Packaging Technologies in the Eastern United States.

Ag-Sintering Improves Performance & Longevity

New technologies have been developed to meet demands for devices with longer life and greater reliability. Electronic devices continue to become smaller and operate at higher power densities and temperatures requiring new approaches in manufacturing. Boschman’s latest sintering technologies address this need offering void-free, strong bonding with high thermal and electrical conductivity. In comparison to traditional solder methods, sinter bonding improves both the performance and longevity of devices. It can decrease the junction temperature (Tj) of your device up to 100℃. In the properly managed sinter process, the silver material changes in form from powder to a solid structure resulting in a more reliable bond.

In addition, Boschman offers in-depth knowledge and experience having supported many customers with sintering solutions over the past decade. Plus, their unique patented silicon-free dynamic insert technology (DIT) guarantees equal pressure for multi-die applications.

Boschman’s Ag-Sintering Products

Boschman’s silver (Ag) sintering solutions fall into two categories. For low-volume production, R&D and prototyping they offer the semi-automatic Sinterstar Innovate series. The Sinterstar Auto and Inline series address the need for medium-volume and high-volume production.

Advantages include:
• Closed loop precise pressure control and monitoring.
• Pressure applied only on areas where required.
• Extremely long life-time of tooling resulting in very low running costs.
• Enabling highest density tools with interspaces down to 400µm.
• Largest available effective sinter area of 350x270mm, providing a high UPH.
• Supporting large variation of geometries, including clips.

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Sinterstar Innovate Series:

Applications: Low-Volume Production, R&D & Prototyping

The most universal semi-automatic sintering system for green, lead-free die attach technologies.

• Capable of sintering a wide range of devices including led, power, igbt, qfn, clip/heatsinks, thyristor and custom designed power module devices.
• Offers the largest sinter area of 350 x 270 mm and a precise temperature control up to 320 C.
• High-precision dynamic insert pressure control technologies allow sintering of multiple dies with different die thicknesses. Resulting in a controlled and predictable bond strength.

Models:
Sinterstar Innovate F-XL:

• Universal semi-automatic sintering system.
• Ideal for R&D and low-volume manufacturing with high yield and high reliability.

Sinterstar Inline and Sinterstar Auto

Applications: Medium-Volume & High-Volume Production

These fully-automatic Ag-sintering systems offer the absolute highest throughput available on the market.

Capable of sintering a wide range of different devices including LEDs, power devices clip/heatsinks assemblies, solar (CVP) cells, custom designed power modules and more.

• Offers the largest sinter area of 350×270 mm.
• Precise process-control and monitoring – logging a large number of key parameters to auto-control the quality with pre-set upper and lower control levels.
• Can be equipped with a large variety of sintering tool concepts.

Models:
Sinterstar Inline-F-XL-HC:

• Fully automatic and can be integrated in your automated assembly line.
• Equipped with preheating and cooling stations.

Sinterstar Auto-F-XL-HC:

• Fully automated and stand-alone system works from cassette input to cassette output.
• Equipped with preheating and cooling stations.

Curious about Ag-Sintering?

If you are interested in learning more you can meet the folks from Boschman at the APEC show in Long Beach, CA from February 25-29th. They will be in Booth #1559. Stop over to discuss how their machines can increase your reliability and yield.

Not attending APEC? Call Kevin Hartsoe or Don Johnson today at 215-355-2460!