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News from Micro Point Pro (MPP)

Semiconductor Packaging News recently ran a feature on Micro Point Pro Ltd. Neu Dynamics Corporation is pleased to represent MPP and we are excited to share the thoughts of their CEO, Oren Saar, recapping 2016 highlights and plans for 2017.

2016 Recap:
2016 was a year of unexpected growth and new challenges for MPP.

Notably, in 2016 MPP expanded their portfolio by acquiring Kulicke and Soffa’s Manual Wire Bonder Division. Since then the iBond 5000 Wire Bonder – an industry favorite – has been relaunched under the MPP brand.

Outlook 2017:

Saar predicts that in 2017 the automotive sector and wireless markets will spur another growth trend with demand for new innovative applications.

In addition, there is significant buzz around a new launch from MPP. In the article Saar states, “In the spring of 2017, we will launch an upgraded wire bonder with new and improved extended features and a state-of-the-art bonding quality, supported by our innovative expendable tools.”

We look forward to sharing more information with you soon!

Read the full article here.

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