The 30th annual Electronics Packaging Symposium (EPS) will take place in Binghamton, NY on September 18th and 19th. Neu Dynamics/NDC International will be displaying in the exhibit hall both days. Stop by to meet us and learn about our packaging equipment – including the innovative systems from Boschman Technologies!
Electronics Packaging Symposium (EPS) 2018 – Programs
The IEEE Electronics Packaging Society offers this symposium as part of its mission to foster close cooperation and exchange of technical information among its members. As the premier electronics manufacturing conference in the Northeast, EPS features over 50 invited technical presentations by leaders and influencers in academia, industry and government.
The program covers the following topics:
• Heterogeneous Integration
• Electronic Materials
• Thermal Challenges
• 2.5D & 3D Packaging
• Power Electronics
• Flexible & Additive Electronics
• Sensors & Embedded Electronics
• Automotive & Harsh Environments
• Photonics & MEMS
• Materials for Energy Storage
The Electronics Packaging Symposium brings together over 250 attendees including today’s decision makers, as well as the future leaders of the industry. In addition, 40+ exhibitors come from across the globe to meet you and learn more about your needs.
Stop by to see us! We look forward to working with you to solve your packaging challenges.
For more information visit the symposium website.
Registration closes at 5 pm EST September 10, 2018. Click here.