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Electronics

Neu Dynamics Semiconductor

Neu Dynamics has a wealth of electronics experience having provided encapsulation and mold tooling for the semiconductor, medical, automotive and electronics industries, to name a few. This inclides production and development tooling for both thermoset and thermoplastic materials. Our high-cavitation molds – which meet the growing demand for capacitor type devices – incorporate features to minimize mold base footprint to allow for maximum mold flow and increased cavitation resulting in optimum yields per cycle.

As a leading supplier of molds and dies since 1972, we provide an array of molds and dies and are familiar with existing automatic multi-plunger and conventional molding systems and can leverage proprietary systems for applications such as ball grid array assembly molds to handle virtually any project.

NDC also has the facilities and press capacity ranging from 25 to 200 tons to handle contract manufacturing in test, and low to medium volume short run production situations.

With NDC, you have the latest in engineering software to assist from product design thru complete manufacturing in addition to the facilities and press capacity ranging from 25 to 200 tons to handle contract manufacturing in test. We also offer an in-house design staff with the ability to assist our customers with part design, and running parameters.

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