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IMAPS 50th Anniversary

IMAPS 50th Anniversary – Join Us at Booth #406! The International Microelectronics Assembly & Packaging Society (IMAPS) will hold its 50th Anniversary Symposium from October 9-12th, 2017 in Raleigh, North Carolina. Neu Dynamics is excited to be exhibiting at the show.  We will be featuring the iBond5000 Dual Wire Bonders from MPP, as well as the PINK Plasma Cleaning System.  Stop by and learn more!  We look forward to meeting …Read More

NDC at iMAPS Device Packaging Show: Stop by Booth #59

The International Microelectronics Assembly and Packaging Society (iMAPS) will hold its 13th International Conference and Exhibition on Device Packaging in Arizona from March 7-9th, 2017. This conference will focus on the technologies and current challenges for packaging and devices of all types. The conference has 3 tracks: 1) 3D IC & Packaging, 2) Flip Chip & Wafer Level Packaging & FAN-OUT, 3) Engineered Micro Systems/Devices (includes MEMS & Sensors).  This …Read More