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Discover Silver Sintering at SEMICON West!

Silver Sintering is an exciting new technology that has captured the interest of our customers this year.  We are now representing Boschman Technologies – a company with a reputation for innovation which specializes in the development and supply of advanced Film-Assisted Molding (FAM) and Sintering Systems for electronic assembly industries across the globe. Boschman has been a high-end niche player within the semiconductor packaging equipment industry since 1987. Going to …Read More

Neu Dynamics at iMaps New England – Booth #104

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts.  The theme is “Into the Future Autonomously” and the Symposium will feature a keynote by Chris Jacobs the Vice President of Autonomous Transportation & Safety at Analog Devices, Incorporated.  Come join us and learn more about the challenges and innovations of autonomous transport. More info here:  http://www.imapsne.org Stop By Booth 104 to …Read More