The International Microelectronics Assembly and Packaging Society (iMAPS) will hold its 13th International Conference and Exhibition on Device Packaging in Arizona from March 7-9th, 2017.
This conference will focus on the technologies and current challenges for packaging and devices of all types. The conference has 3 tracks: 1) 3D IC & Packaging, 2) Flip Chip & Wafer Level Packaging & FAN-OUT, 3) Engineered Micro Systems/Devices (includes MEMS & Sensors). This important conference draws together leading experts interested in exchanging knowledge and offers many technical, social and networking opportunities to industry and academia, as well as different functional groups and experience levels.
Stop By Booth #59 to Meet Us!
NDC will be exhibiting on March 7th and 8th in the sold-out Exhibition and Technology Showcase. We look forward to seeing you in the exhibit hall as we share the best technologies for device packaging available today.
To visit the iMAPS Device Packing event homepage, click here.
Click here to register for the complimentary “Exhibits Only Pass.”
To set up an appointment to meet with us at the iMAPS Device Packaging Show, click here to contact us.