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NDC to Attend 29th Annual EPS!

See You in September NDC will be exhibiting at the 29th Annual Electronics Packaging Symposium (EPS).  This symposium which is offered by The Integrated Electronics Engineering Center (IEEC) is a component of the Small Scale Systems Integration and Packaging Center at Binghamton University. The EPS is the preeminent electronics manufacturing conference in the Northeast.  The symposium brings together the electronics packaging industry’s top talent and minds.  This year EPS will …Read More

SEMICON WEST: Thanks for Visiting!

Great to See You! Thanks to everyone who stopped by to see us at SEMICON West July 11 – 13th! It was a great show with strong attendance and lots of opportunities to discover the smartest new technologies and meet the best people in the industry.  We hope you came home with valuable connections and insights that will help move your business to the next level. Neu Dynamics Hosted Experts …Read More

NDC at SEMICON WEST: Booth #5501

See you at SEMICON West 2017!  “Smart Starts Here” is the theme of SEMICON West 2017!  As our industry evolves with rapidly advancing technologies, SEMICON West offers more informative programs and expanded networking events designed to interest every participant across the diverse electronics supply chain.  Our markets are changing quickly – this year’s SEMICON West will feature the smartest new technologies and people in the industry.  Join us at SEMICON …Read More

Your Guest Invitation to MD&M East!

MD&M East is back, June 13-15, with thousands of industry professionals returning to New York for three days of sourcing, networking, and education. We’ll be there at Booth #658! Now’s your chance to join us … Claim Your Free Expo Badge or Get 20% Off Your Conference Pass! Join us at the expo and discover actionable insights from suppliers, like-minded peers, and expert-led presentations. Or get your conference pass and …Read More

Visit NDC at ECTC: Booth #216

We’re gearing up for the ECTC!  The Electronic Components and Technology Conference (ECTC) will be held in Lake Buena Vista, Florida from May 30 through June 2, 2017.  This show brings together the best in international packaging, components and microelectronic systems science, technology and education.  The show is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. This year, the ECTC will include 36 presentations of …Read More

Continuous Improvement at NDC Starts Top Down

At Neu Dynamics Corporation, a passion for client satisfaction and service excellence is at the core of our beliefs. Our continuous improvement initiative is not only internal and employee related, but also seeks input externally and starts from the top down.  That’s why Neu Dynamics CEO, Kevin Hartsoe, participates in bi-monthly CEO Network Groups with industry colleagues. The group is mentored and organized by Delaware Valley Industrial Resource Center (DVIRC) …Read More

News from Micro Point Pro (MPP)

Semiconductor Packaging News recently ran a feature on Micro Point Pro Ltd. Neu Dynamics Corporation is pleased to represent MPP and we are excited to share the thoughts of their CEO, Oren Saar, recapping 2016 highlights and plans for 2017. 2016 Recap: 2016 was a year of unexpected growth and new challenges for MPP. Notably, in 2016 MPP expanded their portfolio by acquiring Kulicke and Soffa’s Manual Wire Bonder Division. …Read More

NDC Awarded “Excellent” Supplier Rating from Microsemi

At Neu Dynamics Corporation, it is our goal to meet our clients’ needs with the highest-quality parts and materials, according to their schedule and at the lowest possible cost.  That’s why we are pleased to announce that Neu Dynamics Corporation recently received the highest possible “Excellent” Supplier Rating from Microsemi Lawrence. Microsemi is a provider of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets.  …Read More

NDC at iMAPS Device Packaging Show: Stop by Booth #59

The International Microelectronics Assembly and Packaging Society (iMAPS) will hold its 13th International Conference and Exhibition on Device Packaging in Arizona from March 7-9th, 2017. This conference will focus on the technologies and current challenges for packaging and devices of all types. The conference has 3 tracks: 1) 3D IC & Packaging, 2) Flip Chip & Wafer Level Packaging & FAN-OUT, 3) Engineered Micro Systems/Devices (includes MEMS & Sensors).  This …Read More

NDCI Now Directly Representing MPP Manual Wire Bonders

NDC International is happy to announce that they will now be directly handling sales and service for Micro Point Pro (MPP) Manual Wire Bonders in the Northeastern USA and Eastern Canada territories.  The long-time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP.  The newest MPP line is the iBond5000 Series and is based on the 4500 Series which was a market leader …Read More