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Neu Dynamics at iMaps New England – Booth #104

The iMAPS New England 45th Symposium & Expo will be held on May 1, 2018 in Boxborough, Massachusetts.  The theme is “Into the Future Autonomously” and the Symposium will feature a keynote by Chris Jacobs the Vice President of Autonomous Transportation & Safety at Analog Devices, Incorporated.  Come join us and learn more about the challenges and innovations of autonomous transport. More info here:  http://www.imapsne.org Stop By Booth 104 to …Read More

NDCI Now Representing Master Machinery Corp.

NDC International is pleased to announce that we are now representing Master Machinery Corporation (MMC).  As a leading manufacturer and supplier of diodes, rectifiers and semiconductor process equipment and components, MMC offers affordable custom automation. Based in Taiwan, for over 20 years MMC has been a leading supplier of test-mark-tape (TMT) handlers, marking & tape/reel machines, automated assembly equipment & tooling.  The roots of the company go back to 1978 …Read More

NTAP Helps You Invest in Your Workforce

Apprenticeships Are Good for Businesses … and Workers Here at Neu Dynamics we believe in investing in our workforce in the form of apprenticeships.  They are a WIN/WIN for everyone and help ensure we have the skilled workforce and dedicated employees we need to grow our business.  The NTMA (National Tooling and Machining Association) Tri-State Apprenticeship program (NTAP) is a regional competency-based apprenticeship training program. Rather than the traditional 4-year …Read More

Silver Sintering for Electronic & Semiconductor Applications

Reliability of Ag-Sintering Bonding Technology Through a relationship announced a few months ago, NDC International is now representing Boschman Technologies in the Eastern USA.  Boschman, based in the Netherlands, has been a high-end niche player in the semiconductor packaging equipment industry since 1987.  They specialize in the development of advanced Film-Assisted Molding (FAM) and silver sintering systems for electronic assembly industries across the globe. Boschman has been one of the …Read More

Haecker Automation Joins NDC Line-Up

NDC International Now Representing Haecker Automation in North America As we announced a few months ago, NDC International is now representing Haecker Automation in North American.  We are very excited about Haecker Automation’s systems and their commitment to innovation – we think you will be impressed. For more than 20 years, Haecker Automation has provided future-oriented solutions in microsystems technology. The family-owned German company operates worldwide in the fields of …Read More

NDC Now Representing Boschman Technologies

NDC International Representing Boschman Technologies in the Eastern USA We are very proud to announce our new relationship with Boschman Technologies.  NDC International will now be representing Boschman in the Eastern USA.  We are especially excited about Boschman’s reputation for innovation and the resulting advanced systems they offer.  Boschman specializes in the development of advanced Film-Assisted Molding (FAM) and sintering systems for electronic assembly industries across the globe. Boschman Film-Assisted …Read More

NDC Increases Machining Capabilities

Just Installed:  New High-Speed Machining Center at Neu Dynamics At Neu Dynamics we understand the importance of staying ahead of our customers’ manufacturing needs.  Investing in our systems, is an investment in your business.  That’s why we recently installed new high-speed machining equipment here at our facility. The HURCO VM10HSi offers powerful machining with a small footprint.  This vertical milling machine offers productivity and efficiency.  We were impressed with its …Read More

IMAPS 50th Anniversary

IMAPS 50th Anniversary – Join Us at Booth #406! The International Microelectronics Assembly & Packaging Society (IMAPS) will hold its 50th Anniversary Symposium from October 9-12th, 2017 in Raleigh, North Carolina. Neu Dynamics is excited to be exhibiting at the show.  We will be featuring the iBond5000 Dual Wire Bonders from MPP, as well as the PINK Plasma Cleaning System.  Stop by and learn more!  We look forward to meeting …Read More

NDC to Attend 29th Annual EPS!

See You in September NDC will be exhibiting at the 29th Annual Electronics Packaging Symposium (EPS).  This symposium which is offered by The Integrated Electronics Engineering Center (IEEC) is a component of the Small Scale Systems Integration and Packaging Center at Binghamton University. The EPS is the preeminent electronics manufacturing conference in the Northeast.  The symposium brings together the electronics packaging industry’s top talent and minds.  This year EPS will …Read More

SEMICON WEST: Thanks for Visiting!

Great to See You! Thanks to everyone who stopped by to see us at SEMICON West July 11 – 13th! It was a great show with strong attendance and lots of opportunities to discover the smartest new technologies and meet the best people in the industry.  We hope you came home with valuable connections and insights that will help move your business to the next level. Neu Dynamics Hosted Experts …Read More